| Comprehensive study on 2.5 D package design for board-level reliability in thermal cycling and power cycling S Shao, Y Niu, J Wang, R Liu, S Park, H Lee, G Refai-Ahmed, L Yip 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1668-1675, 2018 | 38 | 2018 |
| Investigation of stress in MEMS sensor device due to hygroscopic and viscoelastic behavior of molding compound Y Kim, D Liu, H Lee, R Liu, D Sengupta, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (7 …, 2015 | 38 | 2015 |
| Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3. 0Ag0. 5Cu/Cu solder joints W Liu, Y Tian, C Wang, X Wang, R Liu Materials letters 86, 157-160, 2012 | 30 | 2012 |
| Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions J Wang, R Liu, D Liu, S Park Microelectronics Reliability 73, 42-53, 2017 | 27 | 2017 |
| An examination on the direct concentration approach to simulating moisture diffusion in a multi-material system D Liu, J Wang, R Liu, SB Park Microelectronics Reliability 60, 109-115, 2016 | 24 | 2016 |
| Moisture Diffusion and Hygroscopic Swelling of Adhesives in Electronics Packaging R Liu, H Wang, J Wang, H Lee, S Park, X Xue, Y Kim, S Saiyed, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2203-2209, 2016 | 14 | 2016 |
| Design guideline on board-level thermomechanical reliability of 2.5D package S Shao, Y Niu, J Wang, R Liu, S Park, H Lee, L Yip, G Refai-Ahmed Microelectronics Reliability 111 (113701), 2020 | 9 | 2020 |
| MEMS die warpage during curing of die attach material H Lee, R Liu, S Park, X Xue International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015 | 5 | 2015 |
| Characterization of Creep Behavior of Actual Lead-Free Solder Joint for Modeling H Lee, R Liu, S Park, J Kwak ASME International Mechanical Engineering Congress and Exposition 46590 …, 2014 | 4 | 2014 |
| Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage R Liu, HH Lee, S Park, X Xue International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015 | 2 | 2015 |
| Aging of Polymer Adhesives and Its Reliability Impacts to Electronics Packaging R Liu State University of New York at Binghamton, 2020 | | 2020 |
Seungbae ParkProfessor of Mechanical Engineering, Binghamton UniversityVerified email at binghamton.edu
Seungbae ParkProfessor of Mechanical Engineering, Binghamton UniversityVerified email at binghamton.edu