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Hang Z. YuAssociate Professor of Materials Science and Engineering, Virginia TechVerified email at vt.edu
Daniel GauthierSenior Developer, ResCon TechnologiesVerified email at osu.edu
Hunter RauchPenn StateVerified email at psu.edu
Ting YangMassachusetts Institute of TechnologyVerified email at mit.edu
Mackenzie E.J. PerryVerified email at vt.edu
Rui ZhangAmazon.comVerified email at amazon.com
George BarbastathisProfessor of Mechanical Engineering, Massachusetts Institute of TechnologyVerified email at mit.edu
Hongshun ChenPostdoctoral scholar, Department of Mechanical Engineering, Northwestern UniversityVerified email at northwestern.edu
Zhenyu (James) KongSmart Manufacturing, Industrial & Systems Engineering, Virginia TechVerified email at vt.edu
Chase D. CoxMELD Manufacturing CorporationVerified email at MELDManufacturing.com
Christopher Bryant WilliamsL. S. Randolph Professor of Mechanical Engineering, Virginia TechVerified email at vt.edu
Lee MyungjunSamsung ElectronicsVerified email at kla-tencor.com
Jungsang KimDuke UniversityVerified email at duke.edu
Lei TianBoston University, UC Berkeley, MITVerified email at bu.edu
Laura WallerUC BerkeleyVerified email at alum.mit.edu
Aamod ShankerUniversity of Rochester, NYVerified email at berkeley.edu
Zhengyun ZhangResearch Scientist, BioSystems & Micromechanics IRG, SMARTVerified email at smart.mit.edu
Sonia MelleUniversidad Complutense de Madrid, Optics Department,Verified email at fis.ucm.es
OSCAR GOMEZ CALDERONFacultad de Óptica y Optometría, Universidad Complutense de MadridVerified email at ucm.es
Alexander GaetaApplied Physics and Applied Mathematics, Columbia UniversityVerified email at columbia.edu