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Duane Boning
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Towards Fast Computation of Certified Robustness for ReLU Networks
TW Weng, H Zhang, H Chen, Z Song, CJ Hsieh, D Boning, IS Dhillong, ...
International Conference on Machine Learning (ICML) PMLR 80, 5276-5285, 2018
7462018
Towards stable and efficient training of verifiably robust neural networks
H Zhang, H Chen, C Xiao, S Gowal, R Stanforth, B Li, D Boning, CJ Hsieh
arXiv preprint arXiv:1906.06316, 2019
3332019
Design for manufacturability and statistical design: a constructive approach
M Orshansky, S Nassif, D Boning
Springer Science & Business Media, 2007
3132007
Analysis and decomposition of spatial variation in integrated circuit processes and devices
BE Stine, DS Boning, JE Chung
IEEE Transactions on Semiconductor Manufacturing 10 (1), 24-41, 1997
3031997
Models of process variations in device and interconnect
DS Boning, S Nassif
Design of High Performance Microprocessor Circuits, 98-115, 2000
2602000
The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes
BE Stine, DS Boning, JE Chung, L Camilletti, F Kruppa, ER Equi, W Loh, ...
IEEE Transactions on Electron Devices 45 (3), 665-679, 1998
2541998
Robust deep reinforcement learning against adversarial perturbations on state observations
H Zhang, H Chen, C Xiao, B Li, M Liu, D Boning, CJ Hsieh
Advances in Neural Information Processing Systems 33, 21024-21037, 2020
2512020
Run by run control of chemical-mechanical polishing
DS Boning, WP Moyne, TH Smith, J Moyne, R Telfeyan, A Hurwitz, ...
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1996
2141996
Characterization and Modeling of Oxide Chemical-Mechanical Polishing Using Planarization Length and Pattern Density Concepts
DO Ouma, DS Boning, JE Chung, WG Easter, V Saxena, S Misra, ...
IEEE Transactions on Semiconductor Manufacturing 15 (2), 232-244, 2002
1732002
Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing
BE Stine, DO Ouma, RR Divecha, DS Boning, JE Chung, DL Hetherington, ...
Semiconductor Manufacturing, IEEE Transactions on 11 (1), 129-140, 1998
1701998
A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance
V Mehrotra, SL Sam, D Boning, A Chandrakasan, R Vallishayee, S Nassif
Proceedings of the 37th Annual Design Automation Conference, 172-175, 2000
1672000
The limitations of adversarial training and the blind-spot attack
H Zhang, H Chen, Z Song, D Boning, IS Dhillon, CJ Hsieh
arXiv preprint arXiv:1901.04684, 2019
1502019
A closed-form analytic model for ILD thickness variation in CMP processes
B Stine, D Ouma, R Divecha, D Boning, J Chung, DL Hetherington, I Ali, ...
Chemical-Mechanical Planarization for ULSI Multilevel Interconnect Confer …, 1997
1441997
Robust reinforcement learning on state observations with learned optimal adversary
H Zhang, H Chen, D Boning, CJ Hsieh
arXiv preprint arXiv:2101.08452, 2021
1422021
A self-tuning EWMA controller utilizing artificial neural network function approximation techniques
TH Smith, DS Boning
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1997
1401997
Robust decision trees against adversarial examples
H Chen, H Zhang, D Boning, CJ Hsieh
International Conference on Machine Learning, 1122-1131, 2019
1312019
DOE/Opt: A system for design of experiments, response surface modeling, and optimization using process and device simulation
DS Boning, PK Mozumder
IEEE Transactions on Semiconductor Manufacturing 7 (2), 233-244, 1994
1251994
Modeling the effects of manufacturing variation on high-speed microprocessor interconnect performance
V Mehrotra, S Nassif, D Boning, J Chung
International Electron Devices Meeting 1998. Technical Digest (Cat. No …, 1998
1151998
An integrated characterization and modeling methodology for CMP dielectric planarization
D Ouma, D Boning, J Chung, G Shin, L Olsen, J Clark
Proceedings of the IEEE 1998 International Interconnect Technology …, 1998
1141998
Technology scaling impact of variation on clock skew and interconnect delay
V Mehrotra, D Boning
Proceedings of the IEEE 2001 International Interconnect Technology …, 2001
942001
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Articles 1–20