| A Simulation Tool for Rapid Investigation of Trends in 3-DIC Performance and Power Consumption W Wahby, L Zheng, Y Zhang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (2 …, 2016 | 7 | 2016 |
| Evaluation of 3DICs and fabrication of monolithic interlayer vias W Wahby, A Dembla, M Bakir 3D Systems Integration Conference (3DIC), 2013 IEEE International, 1-6, 2013 | 6 | 2013 |
| Design considerations for 2.5-D and 3-D integration accounting for thermal constraints Y Zhang, X Zhang, W Wahby, MS Bakir 2016 IEEE International 3D Systems Integration Conference (3DIC), 1-5, 2016 | 4 | 2016 |
| The impact of 3D stacking on GPU-accelerated deep neural networks: An experimental study W Wahby, T Sarvey, H Sharma, H Esmaeilzadeh, MS Bakir 3D Systems Integration Conference (3DIC), 2016 IEEE International, 1-4, 2016 | 4 | 2016 |
| Theoretical and Experimental Investigations of Connectivity in Three-Dimensional Integrated Circuits W Wahby Georgia Institute of Technology, 2018 | | 2018 |
| A compact thermal model for phase change memory W Wahby | | 2007 |
| Impact of Alternate Metals on Routing in Scaled Monolithic 3DICs W Wahby | | |
| Approximate Computing and Microfluidic Cooling for Enhanced Machine Learning H Sharma, W Wahby, T Sarvey, MS Bakir, H Esmailzadeh | | |
