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Co-authors
- ni zhaoThe Chinese University of Hong KongVerified email at ee.cuhk.edu.hk
- Xinhui Luthe Chinese University of Hong KongVerified email at phy.cuhk.edu.hk
- Jian-Bin XU (许建斌, J.B. XU)Professor of Electronic Engineering, The Chinese University of Hong KongVerified email at ee.cuhk.edu.hk
- Hon Ki TsangDean, Faculty of Engineering, The Chinese University of Hong KongVerified email at ee.cuhk.edu.hk
- Qiang ZhuYunnan UniversityVerified email at ynu.edu.cn
- Shu ZhouSun Yat-Sen UniversityVerified email at mail.sysu.edu.cn
- Chester ShuThe Chinese University of Hong KongVerified email at ee.cuhk.edu.hk
- Yifan DongChina University of Geosciences; Chinese University of Hong Kong; University of Wisconsin MadisonVerified email at cug.edu.cn
- Jiangquan MaiThe Chinese University of Hong KongVerified email at link.cuhk.edu.hk
- Guoqing ZhouNVIDIA, LANL, USCVerified email at usc.edu
- Wei-Hsin Liao (廖維新)Chinese University of Hong Kong, Choh-Ming Li Professor of Mechanical and Automation EngineeringVerified email at cuhk.edu.hk
- Haihua XuDepartment of Biomedical Engineering, Medical School,Shenzhen UniversityVerified email at szu.edu.cn