| Isochronous data link across a superconducting Nb flex cable with 5 femtojoules per bit H Dai, C Kegerreis, DW Gamage, J Egan, M Nielsen, Y Chen, ... Superconductor Science and Technology 35 (4), 045014, 2022 | 7 | 2022 |
| Face-to-face cable interconnect scheme for thin flexible superconducting stripline cables B Yelamanchili, A Shah, SE Peek, V Gupta, JA Sellers, DB Tuckerman, ... IEEE Transactions on Applied Superconductivity 32 (4), 1-5, 2022 | 7 | 2022 |
| Superconducting molybdenum multi-chip module approach for cryogenic and quantum applications A Shah, SE Peek, B Yelamanchili, V Gupta, DB Tuckerman, C Cantaloube, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 276-282, 2022 | 5 | 2022 |
| Towards cable-to-cable connectors for flexible thin-film superconducting transmission lines A Shah, V Gupta, B Yelamanchili, SE Peek, MFF Chowdhury, AS Rashid, ... IEEE Transactions on Applied Superconductivity 31 (5), 1-6, 2021 | 5 | 2021 |
| The effect of vibration induced fretting on contact failure in the coaxial connector Q Li, GT Flowers, J Gao, S Peek, M Hamilton, MJ Bozack 2019 IEEE Holm Conference on Electrical Contacts, 204-210, 2019 | 5 | 2019 |
| Reliability characterization of a flexible interconnect for cryogenic and quantum applications ER Schmidgall, F Griggio, GH Thiel, SE Peek, B Yelamanchili, A Shah, ... 2021 IEEE International Reliability Physics Symposium (IRPS), 1-7, 2021 | 4 | 2021 |
| Fabrication and Assembly Processes for Custom and Commercial Flip-Chip Connections to Fine Pitch In Bump Arrays S Peek, V Gupta, B Yelamanchili, T Stegeman, T Isaacs-Smith, JA Sellers, ... 15th International Conference and Exhibition on Device Packaging, 2019 | 4 | 2019 |
| Superconducting microwave interconnect technologies for quantum and cryogenic systems MC Hamilton, B Yelamanchili, A Shah, SE Peek, S Bankson, CC Tillman 2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 72-75, 2022 | 3 | 2022 |
| Fabrication and Flip-Chip Assembly Processes For Cryogenic Applications Using Indium-Indium and SAC-Indium Bump Connections on Flexible Interconnects SE Peek, V Gupta, B Yelamanchili, A Shah, JA Sellers, DB Tuckerman, ... GOMACTech 2021, 2021 | 3 | 2021 |
| Additive manufacturing and characterization of microstructures using two-photon polymerization for use in cryogenic applications SE Peek, J Ward, S Bankson, A Shah, JA Sellers, ML Adams, ... Journal of Materials Research 37 (12), 1978-1985, 2022 | 1 | 2022 |
| Approaches for high performance and thermally optimized flexible cryogenic microwave ribbon cables SE Peek, A Shah, B Yelamanchili, V Gupta, JA Sellers, DB Tuckerman, ... IOP Conference Series: Materials Science and Engineering 1241 (1), 012027, 2022 | 1 | 2022 |
| Increasing Chip-to-Substrate Spacing Using In Capped SnPb Pillars as Flip Chip Interconnects for Physical Isolation in Superconducting Applications GD Hughes, SE Peek, A Shah, MC Hamilton, ML Adams IEEE Transactions on Applied Superconductivity, 2024 | | 2024 |
| Methodology to Characterize Thermal Properties of Thin Film Superconductors Using a DynaCool Physical Property Measurement System H Goyal, SE Peek, JA Sellers, MC Hamilton IEEE Transactions on Applied Superconductivity, 2023 | | 2023 |
| Influence of Laser Processing Proximity on Superconducting Film Performance SE Peek, A Shah, G Gleason, J Ward, ML Adams, MC Hamilton IEEE Transactions on Applied Superconductivity, 2023 | | 2023 |
| LASER PROCESSES FOR MOLYBDENUM-BASED SUBSTRATES SE Peek, G Hughes, JA Sellers, M Mahjouri-Samani, ML Adams, ... | | |
