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Jiahao PangInterDigitalVerified email at interdigital.com
Gene CheungProfessor, Department of EECS, York UniversityVerified email at yorku.ca
Wenxiu SunThe Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
Antonio OrtegaDean's Professor of Electrical and Computer Engineering, University of Southern CaliforniaVerified email at usc.edu
Yonggen LingTencent Robotics XVerified email at connect.ust.hk
Michael Kwok-Po NgSIAM Fellow, AAIA Fellow and Chair Professor, Department of Mathematics, The University of Hong KongVerified email at maths.hku.hk
Cheng YangShanghai University of Electric PowerVerified email at shiep.edu.cn
Yuanfang GuoBeihang UniversityVerified email at connect.ust.hk
Wei DaiHong Kong University of Science and TechnologyVerified email at ust.hk
Lu FANGTsinghua UniversityVerified email at tsinghua.edu.cn
Qiong YanSenseTime ResearchVerified email at sensetime.com
Jimmy S. RenSenseTime ResearchVerified email at my.cityu.edu.hk
Liang LinFellow of IAPR, Professor of Computer Science, Sun Yat-Sen University, ChinaVerified email at ieee.org
Joan Serra-SagristaUniversitat Autònoma de Barcelona (Spain)Verified email at uab.cat
Yung-Hsuan ChaoQualcomm Technologies, Inc.Verified email at qti.qualcomm.com
Mengqi Ji 季梦奇Assoc. Prof.@BUAA; Post-doc@Tsinghua Univ.; Ph.D.@HKUSTVerified email at buaa.edu.cn
Sunil JaiswalPh.D., Hong Kong University of Science and technologyVerified email at connect.ust.hk
Houqiang LiProfessor, Department of Electric Engineering and Information Science, University of Science andVerified email at ustc.edu.cn