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Devesh Dadhich Shreeram
Devesh Dadhich Shreeram
Verified email at micron.com - Homepage
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Cited by
Cited by
Year
Degradation of Congo red pollutants using microwave derived SrFe12O19: An efficient magnetic photocatalyst under visible light
O Mohanta, YN Singhbabu, SK Giri, D Dadhich, NN Das, RK Sahu
Journal of Alloys and Compounds 564, 78–83, 2013
792013
Effect of reverse pulse time on electrodeposited Ni-W coatings
DD Shreeram, S Li, V Bedekar, H Cong, GL Doll
Surface and Coatings Technology 325, 386–396, 2017
332017
Properties and Tribological Performance of Vanadium Carbide Coatings on AISI 52100 Steel Deposited by Thermoreactive Diffusion
BL Strahin, DD Shreeram, GL Doll
JOM 69 (7), 1160–1164, 2017
312017
Urine-powered microbial fuel cell using a hyperpiliated pilT mutant of Pseudomonas aeruginosa
DD Shreeram, DJ Hassett, DW Schaefer
Journal of Industrial Microbiology and Biotechnology 43 (1), 103-107, 2016
282016
Capsule-embedded reduced graphene oxide: synthesis, mechanism and electrical properties
YN Singhbabu, KK Sahu, D Dadhich, AK Pramanick, T Mishra, RK Sahu
Journal of Materials Chemistry C 1 (5), 958-966, 2013
282013
Effect of impaired twitching motility and biofilm dispersion on performance of Pseudomonas aeruginosa-powered microbial fuel cells
DD Shreeram, W Panmanee, CT McDaniel, S Daniel, DW Schaefer, ...
Journal of Industrial Microbiology and Biotechnology 45 (2), 103-109, 2018
202018
Corrosion-and wear-resistant pulse reverse current (PRC)-based electrodeposited Ni-W coating
DD Shreeram, V Bedekar, S Li, H Cong, GL Doll
Jom 70, 2603-2610, 2018
102018
Development of Wear and Corrosion Resistant Nickel Based Coatings Through Pulse Reverse Current (PRC) Electrodeposition Process
DD Shreeram
Ph. D. Thesis, 2017
22017
Effect of Reverse Pulse Current Duration on the Corrosion and Wear Performance of Ni-W Nanolaminate Coatings
DD Shreeram, V Bedekar, S Li, R Jagtap, H Cong, GL Doll
JOM, 2017
12017
Over-sculpted storage node
DD Shreeram, S Sapra, K Li, S Korkmaz
US Patent App. 17/944,649, 2024
2024
Integrated assemblies and methods of forming integrated assemblies
Y Nakamura, DD Shreeram, YF Lee, SE Sills, JA Imonigie, K Shrimali
US Patent 11,848,360, 2023
2023
Digit line and cell contact isolation
AP Chan, S Sapra, V Yadav, YT Lin, DD Shreeram
US Patent App. 17/731,895, 2023
2023
Integrated memory with redistribution of capacitor connections, and methods of forming integrated memory
Y Guangjun, V Nair, DD Shreeram, A Panday, K Li, Z Xie, S Borsari, ...
US Patent 11,563,008, 2023
2023
Capacitors with electrodes having a portion of material removed, and related semiconductor devices, systems, and methods
DD Shreeram, K Li, MN Rocklein, WC Huang, PC Hsu, S Korkmaz, ...
US Patent App. 17/647,902, 2022
2022
Semiconductor structure patterning
S Korkmaz, DD Shreeram, S Balakrishnan, D Ray, S Sapra, PA Paduano
US Patent 11,011,521, 2021
2021
Column formation using sacrificial material
DD Shreeram, DTN Tran, S Sapra
US Patent 11,011,523, 2021
2021
Formation of a capacitor using a hard mask
DTN Tran, DD Shreeram, S Sapra
US Patent 10,978,553, 2021
2021
Formation of a capacitor using a sacrificial layer
DD Shreeram, S Korkmaz, J Li, S Sapra, D Ray
US Patent 10,964,475, 2021
2021
Reduction of roughness on a sidewall of an opening
CJ Gambee, DD Shreeram, IV Vasilyeva
US Patent 10,923,478, 2021
2021
Storage node shaping
DD Shreeram, SS Kelkar, GS Lugani, PA Paduano, MN Rocklein, S Sapra, ...
US Patent 10,811,419, 2020
2020
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