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Co-authors
Costas SpanosProfessor of Electrical Engineering and Computer Sciences, University of California, BerkeleyVerified email at berkeley.edu- Lihua XieProfessor of Electrical Engineering, Nanyang Technological UniversityVerified email at ntu.edu.sg
- Reza ArghandehProfessor, Western Norway University of Applied SciencesVerified email at hvl.no
- Lin ZhangTsinghua UniversityVerified email at mail.tsinghua.edu.cn
- Guoqiang HuNanyang Technological University (NTU), SingaporeVerified email at ntu.edu.sg
- Zimu ZhouAssistant Professor, Singapore Management UniversityVerified email at smu.edu.sg
- Joyce KimUniversity of WaterlooVerified email at berkeley.edu
- Stefano SchiavonAssoc. Professor of Architecture and Civil & Environmental Engineering, University of CaliforniaVerified email at berkeley.edu
- Ioannis C. KonstantakopoulosApplied Scientist II @ Amazon.com - Alexa Artificial Intelligence (AI)Verified email at amazon.com
- Baihong Jin (金柏宏)PhD Student in EECS, University of California, BerkeleyVerified email at eecs.berkeley.edu
- Paul RafteryCBE, UC BerkeleyVerified email at berkeley.edu
- Gail S. BragerUniversity of California, BerkeleyVerified email at berkeley.edu
- Shayaan AbdullahVerified email at berkeley.edu
- Jose David CordovaMS and PhD in Electrical Engineering, Florida State UniversityVerified email at my.fsu.edu
- Baoqi Huang (黄宝琦)Professor, College of Computer Science, Inner Mongolia University, China.Verified email at imu.edu.cn
- Alberto Sangiovanni VincentelliProfessor of EECS, University of California, BerkeleyVerified email at eecs.berkeley.edu
- Pierluigi NuzzoViterbi School of Engineering, University of Southern CaliforniaVerified email at usc.edu
- Alexandra Von MeierVerified email at berkeley.edu
- Ninghang Hu 胡宁杭Expert, Engagement Manager at McKinsey & CompanyVerified email at mckinsey.com
- Zuo-Jun Max SHENProfessor, UC BerkeleyVerified email at berkeley.edu
