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Thomas Sarvey
Thomas Sarvey
ECE Graduate Student, Georgia Institute of Technolgy
Verified email at gatech.edu
Title
Cited by
Cited by
Year
Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering
D Lorenzini, C Green, TE Sarvey, X Zhang, Y Hu, AG Fedorov, MS Bakir, ...
International Journal of Heat and Mass Transfer 103, 1359-1370, 2016
932016
A review of two-phase forced cooling in three-dimensional stacked electronics: technology integration
C Green, P Kottke, X Han, C Woodrum, T Sarvey, P Asrar, X Zhang, ...
Journal of Electronic Packaging 137 (4), 040802, 2015
712015
Embedded cooling technologies for densely integrated electronic systems
TE Sarvey, Y Zhang, L Zheng, P Thadesar, R Gutala, C Cheung, ...
2015 IEEE Custom Integrated Circuits Conference (CICC), 1-8, 2015
442015
Integrated circuit cooling using heterogeneous micropin-fin arrays for nonuniform power maps
TE Sarvey, Y Hu, CE Green, PA Kottke, DC Woodrum, YK Joshi, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017
402017
Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps
MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ...
International Journal of Heat and Mass Transfer 108, 1702-1713, 2017
392017
Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems
TE Sarvey, Y Zhang, Y Zhang, H Oh, MS Bakir
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
322014
Monolithic integration of a micropin-fin heat sink in a 28-nm FPGA
TE Sarvey, Y Zhang, C Cheung, R Gutala, A Rahman, A Dasu, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017
302017
Hotspot thermal management with flow boiling of refrigerant in ultrasmall microgaps
MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ...
Journal of Electronic Packaging 139 (1), 011006, 2017
262017
Thermal evaluation of 2.5-D integration using bridge-chip technology: Challenges and opportunities
Y Zhang, TE Sarvey, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (7 …, 2017
192017
Three-dimensional integrated circuit with embedded microfluidic cooling: Technology, thermal performance, and electrical implications
X Zhang, X Han, TE Sarvey, CE Green, PA Kottke, AG Fedorov, Y Joshi, ...
Journal of Electronic Packaging 138 (1), 010910, 2016
182016
Single phase liquid cooling of hotspots in a heterogeneous pin-fin-enhanced microgap with non-uniform fin array
Y Hu, T Sarvey, M Bakir, Y Joshi
2017 16th IEEE intersociety conference on thermal and thermomechanical …, 2017
172017
Combined finned microgap with dedicated extreme-microgap hotspot flow for high performance thermal management
R Abbaspour, DC Woodrum, PA Kottke, TE Sarvey, CE Green, YK Joshi, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
162016
Fluid routing devices and methods for cooling integrated circuit packages
R Gutala, A Rahman, A Dasu, T Sarvey, D Kulkarni
US Patent 10,770,372, 2020
152020
Thermal isolation using air gap and mechanically flexible interconnects for heterogeneous 3-D ICs
Y Zhang, Y Zhang, T Sarvey, C Zhang, M Zia, M Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (1 …, 2015
152015
Flow boiling of R245fa in a microgap with integrated staggered pin fins
P Asrar, X Zhang, CD Woodrum, CE Green, PA Kottke, TE Sarvey, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
142016
Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation
Y Zhang, TE Sarvey, MS Bakir
2014 International 3D Systems Integration Conference (3DIC), 1-5, 2014
142014
Dynamic thermal management for 3-D ICs with time-dependent power map using microchannel cooling and machine learning
YS Li, H Yu, H Jin, TE Sarvey, H Oh, MS Bakir, M Swaminathan, EP Li
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (7 …, 2019
132019
Flow visualization of two phase flow of R245fa in a microgap with integrated staggered pin fins
P Asrar, X Zhang, CE Green, PA Kottke, TE Sarvey, A Fedorov, MS Bakir, ...
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2016
122016
Microfluidic cooling of a 14-nm 2.5-D FPGA with 3-D printed manifolds for high-density computing: Design considerations, fabrication, and electrical characterization
TE Sarvey, A Kaul, SK Rajan, A Dasu, R Gutala, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019
102019
3D IC with embedded microfluidic cooling: technology, thermal performance, and electrical implications
X Zhang, X Han, TE Sarvey, CE Green, PA Kottke, AG Fedorov, Y Joshi, ...
International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015
102015
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