| Stress calculation in atomistic simulations of perfect and imperfect solids J Cormier, JM Rickman, TJ Delph Journal of Applied Physics 89 (1), 99-104, 2001 | 301 | 2001 |
| Effect of yttrium and lanthanum on the tensile creep behavior of aluminum oxide J Cho, MP Harmer, HM Chan, JM Rickman, AM Thompson Journal of the American Ceramic Society 80 (4), 1013-1017, 1997 | 251 | 1997 |
| Role of segregating dopants on the improved creep resistance of aluminum oxide J Cho, CM Wang, HM Chan, JM Rickman, MP Harmer Acta materialia 47 (15-16), 4197-4207, 1999 | 174 | 1999 |
| Materials informatics for the screening of multi-principal elements and high-entropy alloys JM Rickman, HM Chan, MP Harmer, JA Smeltzer, CJ Marvel, A Roy, ... Nature communications 10 (1), 2618, 2019 | 154 | 2019 |
| Materials informatics: From the atomic-level to the continuum JM Rickman, T Lookman, SV Kalinin Acta Materialia 168, 473-510, 2019 | 142 | 2019 |
| Free-energy calculations in materials research JM Rickman, R LeSar Annual Review of Materials Research 32 (1), 195-217, 2002 | 139 | 2002 |
| Grain boundary complexion transitions PR Cantwell, T Frolov, TJ Rupert, AR Krause, CJ Marvel, GS Rohrer, ... Annual Review of Materials Research 50, 465-492, 2020 | 129 | 2020 |
| Defect interactions on solid surfaces JM Rickman, DJ Srolovitz Surface science 284 (1-2), 211-221, 1993 | 98 | 1993 |
| Dislocation motion in the presence of diffusing solutes: a computer simulation study Y Wang, DJ Srolovitz, JM Rickman, R Lesar Acta materialia 48 (9), 2163-2175, 2000 | 94 | 2000 |
| Surface and grain boundary scattering in nanometric Cu thin films: A quantitative analysis including twin boundaries K Barmak, A Darbal, KJ Ganesh, PJ Ferreira, JM Rickman, T Sun, B Yao, ... Journal of Vacuum Science & Technology A 32 (6), 2014 | 92 | 2014 |
| Codoping of alumina to enhance creep resistance YZ Li, C Wang, HM Chan, JM Rickman, MP Harmer, JM Chabala, ... Journal of the American Ceramic Society 82 (6), 1497-1504, 1999 | 84 | 1999 |
| A methodology for automated quantitative microstructural analysis of transmission electron micrographs DT Carpenter, JM Rickman, K Barmak Journal of applied physics 84 (11), 5843-5854, 1998 | 77 | 1998 |
| Twinning in thin films—I. Elastic analysis N Sridhar, JM Rickman, DJ Srolovitz Acta materialia 44 (10), 4085-4096, 1996 | 73 | 1996 |
| Impact of heterogeneous boundary nucleation on transformation kinetics and microstructure JM Rickman, WS Tong, K Barmak Acta materialia 45 (3), 1153-1166, 1997 | 66 | 1997 |
| Review of grain boundary complexion engineering: Know your boundaries AR Krause, PR Cantwell, CJ Marvel, C Compson, JM Rickman, ... Journal of the American Ceramic Society 102 (2), 778-800, 2019 | 65 | 2019 |
| Microstructural stability of stressed lamellar and fiber composites N Sridhar, JM Rickman, DJ Srolovitz Acta materialia 45 (7), 2715-2733, 1997 | 63 | 1997 |
| Scanning Transmission Electron Microscopy Analysis of Grain Boundaries in Creep‐Resistant Yttrium‐and Lanthanum‐Doped Alumina Microstructures J Bruley, J Cho, HM Chan, MP Harmer, JM Rickman Journal of the American Ceramic Society 82 (10), 2865-2870, 1999 | 59 | 1999 |
| Multipole expansion of dislocation interactions: application to discrete dislocations R Lesar, JM Rickman Physical Review B 65 (14), 144110, 2002 | 56 | 2002 |
| Influence of yttrium doping on grain misorientation in aluminum oxide J Cho, HM Chan, MP Harmer, JM Rickman Journal of the American Ceramic Society 81 (11), 3001-3004, 1998 | 55 | 1998 |
| Twinning in thin films—II. Equilibrium microstructures N Sridhar, JM Rickman, DJ Srolovitz Acta materialia 44 (10), 4097-4113, 1996 | 55 | 1996 |
