Ingrid De Wolf
Ingrid De Wolf
imec AND KU Leuven
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Cited by
Cited by
Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits
I De Wolf
Semiconductor science and technology 11 (2), 139, 1996
Stress measurements in silicon devices through Raman spectroscopy: Bridging the gap between theory and experiment
I De Wolf, HE Maes, SK Jones
Journal of Applied Physics 79 (9), 7148-7156, 1996
Design issues and considerations for low-cost 3-D TSV IC technology
G Van der Plas, P Limaye, I Loi, A Mercha, H Oprins, C Torregiani, S Thijs, ...
IEEE Journal of Solid-State Circuits 46 (1), 293-307, 2010
A comprehensive model to predict the charging and reliability of capacitive RF MEMS switches
WM Van Spengen, R Puers, R Mertens, I De Wolf
Journal of Micromechanics and Microengineering 14 (4), 514, 2004
A physical model to predict stiction in MEMS
WM Van Spengen, R Puers, I De Wolf
Journal of micromechanics and microengineering 12 (5), 702, 2002
Stress measurements in Si microelectronics devices using Raman spectroscopy
I De Wolf
Journal of Raman spectroscopy 30 (10), 877-883, 1999
Optical inspection of Microsystems
W Osten, A Duparre, C Furlong, I De Wolf, A Asundi, K Korner, D Vogel, ...
CRC press, 2018
Micro‐Raman study of stress distribution in local isolation structures and correlation with transmission electron microscopy
I De Wolf, J Vanhellemont, A Romano‐Rodríguez, H Norström, HE Maes
Journal of Applied Physics 71 (2), 898-906, 1992
Analytical model of the DC actuation of electrostatic MEMS devices with distributed dielectric charging and nonplanar electrodes
X Rottenberg, I De Wolf, BKJC Nauwelaers, W De Raedt, HAC Tilmans
Journal of Microelectromechanical Systems 16 (5), 1243-1253, 2007
Printed circuit board technology inspired stretchable circuits
J Vanfleteren, M Gonzalez, F Bossuyt, YY Hsu, T Vervust, I De Wolf, ...
MRS bulletin 37 (3), 254-260, 2012
Stresses and strains in lattice‐mismatched stripes, quantum wires, quantum dots, and substrates in Si technology
SC Jain, HE Maes, K Pinardi, I De Wolf
Journal of applied physics 79 (11), 8145-8165, 1996
Fabrication and reliability testing of Ti/TiN heaters
P De Moor, A Witvrouw, V Simons, I De Wolf
Micromachining and Microfabrication Process Technology V 3874, 284-293, 1999
Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k/metal gate CMOS performance
A Mercha, G Van der Plas, V Moroz, I De Wolf, P Asimakopoulos, N Minas, ...
2010 International Electron Devices Meeting, 2.2. 1-2.2. 4, 2010
Cu pumping in TSVs: Effect of pre-CMP thermal budget
I De Wolf, K Croes, OV Pedreira, R Labie, A Redolfi, M Van De Peer, ...
Microelectronics Reliability 51 (9-11), 1856-1859, 2011
Study of damage and stress induced by backgrinding in Si wafers
J Chen, I De Wolf
Semiconductor science and technology 18 (4), 261, 2003
On the physics of stiction and its impact on the reliability of microstructures
WM Van Spengen, R Puers, I De Wolf
Journal of adhesion science and technology 17 (4), 563-582, 2003
Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization
YY Hsu, M Gonzalez, F Bossuyt, J Vanfleteren, I De Wolf
IEEE transactions on electron devices 58 (8), 2680-2688, 2011
Strain determination in silicon microstructures by combined convergent beam electron diffraction, process simulation, and micro-Raman spectroscopy
V Senez, A Armigliato, I De Wolf, G Carnevale, R Balboni, S Frabboni, ...
Journal of Applied Physics 94 (9), 5574-5583, 2003
Raman spectroscopy: Chips and stress
I De Wolf
Spectroscopy Europe 15 (2), 6-13, 2003
Non-uniform triggering of gg-nMOSt investigated by combined emission microscopy and transmission line pulsing
C Russ, K Bock, M Rasras, I De Wolf, G Groeseneken, HE Maes
Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 1998 …, 1998
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Articles 1–20