| Room temperature Cu–Cu direct bonding using surface activated bonding method TH Kim, MMR Howlader, T Itoh, T Suga Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 21 (2 …, 2003 | 279 | 2003 |
| Polymer integration for packaging of implantable sensors Y Qin, MMR Howlader, MJ Deen, YM Haddara, PR Selvaganapathy Sensors and Actuators B: Chemical 202, 758-778, 2014 | 149 | 2014 |
| Microfabricated electrochemical pH and free chlorine sensors for water quality monitoring: Recent advances and research challenges Y Qin, HJ Kwon, MMR Howlader, MJ Deen RSC Advances 5 (85), 69086-69109, 2015 | 148 | 2015 |
| Electrochemical sensing of acetaminophen using multi-walled carbon nanotube and β-cyclodextrin AU Alam, Y Qin, MMR Howlader, NX Hu, MJ Deen Sensors and Actuators B: Chemical, 2017 | 144 | 2017 |
| The effects of oxygen plasma and humidity on surface roughness, water contact angle and hardness of silicon, silicon dioxide and glass AU Alam, MMR Howlader, MJ Deen Journal of Micromechanics and Microengineering 24 (3), 035010, 2014 | 118 | 2014 |
| Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding AU Alam, MMR Howlader, MJ Deen ECS Journal of Solid State Science and Technology 2 (12), P515-P523, 2013 | 113 | 2013 |
| Polymers and organic materials-based pH sensors for healthcare applications AU Alam, Y Qin, S Nambiar, JTW Yeow, MMR Howlader, NX Hu, MJ Deen Progress in Materials Science 96, 174-216, 2018 | 111 | 2018 |
| Room temperature wafer level glass/glass bonding MMR Howlader, S Suehara, T Suga Sensors and Actuators A: Physical 127 (1), 31-36, 2006 | 92 | 2006 |
| Inkjet Printing of a Highly Loaded Palladium Ink for Integrated, Low-Cost pH Sensors Y Qin, AU Alam, MMR Howlader, NX Hu, MJ Deen Advanced Functional Materials, 2016 | 83 | 2016 |
| Wafer level surface activated bonding tool for MEMS packaging MMR Howlader, H Okada, TH Kim, T Itoh, T Suga Journal of The Electrochemical Society 151 (7), G461-G467, 2004 | 79 | 2004 |
| Integrated water quality monitoring system with pH, free chlorine, and temperature sensors Y Qin, AU Alam, S Pan, MMR Howlader, R Ghosh, NX Hu, H Jin, S Dong, ... Sensors and Actuators B: Chemical 255, 781-790, 2018 | 74 | 2018 |
| Room-temperature microfluidics packaging using sequential plasma activation process MMR Howlader, S Suehara, H Takagi, TH Kim, R Maeda, T Suga IEEE transactions on advanced packaging 29 (3), 448-456, 2006 | 72 | 2006 |
| Nanobonding technology toward electronic, fluidic, and photonic systems integration MMR Howlader, PR Selvaganapathy, MJ Deen, T Suga IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 689-703, 2010 | 71 | 2010 |
| Room temperature bonding of silicon and lithium niobate MMR Howlader, T Suga, MJ Kim Applied physics letters 89 (3), 031914, 2006 | 70 | 2006 |
| Characterization of the bonding strength and interface current of wafers bonded by surface activated bonding method at room temperature MMR Howlader, T Watanabe, T Suga Journal of applied physics 91 (5), 3062-3066, 2002 | 65* | 2002 |
| Inkjet-printed bifunctional carbon nanotubes for pH sensing Y Qin, HJ Kwon, A Subrahmanyam, MMR Howlader, PR Selvaganapathy, ... Materials Letters 176, 68-70, 2016 | 58 | 2016 |
| Investigation of the bonding strength and interface current of p-Si/n-GaAs wafers bonded by surface activated bonding at room temperature MMR Howlader, T Watanabe, T Suga Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2001 | 58 | 2001 |
| Tailoring MWCNTs and β-Cyclodextrin for Sensitive Detection of Acetaminophen and Estrogen AU Alam, Y Qin, M Catalano, L Wang, MJ Kim, MMR Howalder, NX Hu, ... ACS Appl Mater Interfaces, 2018 | 57 | 2018 |
| Fabrication of highly sensitive Bisphenol A electrochemical sensor amplified with chemically modified multiwall carbon nanotubes and β-cyclodextrin YM Ali, AU Alam, MMR Howlader Sensors and Actuators B, 2020 | 51 | 2020 |
| Combined process for wafer direct bonding by means of the surface activation method T Suga, TH Kim, MMR Howlader 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 51 | 2004 |
Tadatomo SugaMeisei UniversityVerified email at gakushikai.jp
