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Co-authors
- Guozhong CaoUniversity of WashingtonVerified email at u.washington.edu
- Zhouguang LuProfessor of Materials Science and Engineering, Southern University of Science and TechnologyVerified email at sustc.edu.cn
- Wenjun ZhangCity University of Hong KongVerified email at cityu.edu.hk
- ShaoZhuan Huang (黄绍专)South-Central Minzu UniversityVerified email at scuec.edu.cn
- Yi Cai (蔡祎)School of Materials Science and Engineering, Nanyang Technological UniversityVerified email at ntu.edu.sg
- Juan Antonio ZapienCity Uniiversity of Hong KongVerified email at cityu.edu.hk
- Chaoping LiuShantou UniversityVerified email at stu.edu.cn
- Tawfique HasanProfessor of NanoEngineering, Engineering Department, University of CambridgeVerified email at cam.ac.uk
- Zhi-Yi HuNRC (Nanostructure Research Centre), Wuhan University of TechnologyVerified email at whut.edu.cn
- Jonathan C.Y. ChungDept. of Physics & Materials Science, City University of Hong KongVerified email at cityu.edu.hk
- Ruguang Ma (马汝广)Shanghai Institute of Ceramics, Chinese Academy of SciencesVerified email at mail.sic.ac.cn
- Zachary G. NealeU.S. Naval Research LaboratoryVerified email at nrl.navy.mil
- Bin Huang(黄斌)Guilin University of TechnologyVerified email at u.washington.edu
- Fei HuangProfessor, South China University of TechnologyVerified email at scut.edu.cn
- Ludvik MartinuProfessor of Engineering Physics, Polytechnique MontrealVerified email at polymtl.ca
- Shrawan Kumar Jha, PhD, SMIEEEImperial College LondonVerified email at imperial.ac.uk
- C.S. LeeCity University of Hong KongVerified email at cityu.edu.hk
- Robert C. MasséUniversity of WashingtonVerified email at u.washington.edu
- Andrey RogachChair Professor, City University of Hong KongVerified email at cityu.edu.hk
- Yan LiuSun Yat-sen UniversityVerified email at mail.sysu.edu.cn