| Novel three-dimensional carbon nanotube networks as high performance thermal interface materials Q Kong, L Bodelot, B Lebental, YD Lim, LL Shiau, B Gusarov, CW Tan, ... Carbon 132, 359-369, 2018 | 35 | 2018 |
| Enhanced field emission properties of carbon nanotube films using densification technique YD Lim, Q Kong, S Wang, CW Tan, BK Tay, S Aditya Applied Surface Science 477, 211-219, 2019 | 28 | 2019 |
| Enhanced carbon nanotubes growth using nickel/ferrocene-hybridized catalyst YD Lim, AV Avramchuck, D Grapov, CW Tan, BK Tay, S Aditya, ... ACS omega 2 (9), 6063-6071, 2017 | 27 | 2017 |
| TSV-integrated surface electrode ion trap for scalable quantum information processing P Zhao, JP Likforman, HY Li, J Tao, T Henner, YD Lim, WW Seit, CS Tan, ... Applied Physics Letters 118 (12), 2021 | 22 | 2021 |
| Field emission cathode based on three-dimensional framework carbon and its operation under the driving of a triboelectric nanogenerator J Chen, B Yang, YD Lim, L Su, J Yang, R Guo, BK Tay, X Yan Nano Energy 49, 308-315, 2018 | 21 | 2018 |
| Enhanced field emission properties of carbon nanotube bundles confined in SiO2 pits YD Lim, D Grapov, L Hu, Q Kong, BK Tay, V Labunov, J Miao, P Coquet, ... Nanotechnology 29 (7), 075205, 2018 | 20 | 2018 |
| Ti3C2 (MXene) based field electron emitters J Chen, B Yang, YD Lim, W Duan, Y Zhao, BK Tay, X Yan Nanotechnology 31 (28), 285701, 2020 | 17 | 2020 |
| Thermal conductivity characterization of three dimensional carbon nanotube network using freestanding sensor-based 3ω technique Q Kong, L Qiu, YD Lim, CW Tan, K Liang, C Lu, BK Tay Surface and Coatings Technology 345, 105-112, 2018 | 15 | 2018 |
| In-depth parametric study of Ar or N2 plasma activated Cu surfaces for Cu-Cu direct bonding L Hu, SCK Goh, J Tao, YD Lim, P Zhao, MJZ Lim, CS Tan 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 420-425, 2021 | 14 | 2021 |
| Fabrication and characterization of surface electrode ion trap for quantum computing J Tao, NP Chew, L Guidoni, YD Lim, P Zhao, CS Tan 2018 ieee 20th electronics packaging technology conference (eptc), 363-366, 2018 | 12 | 2018 |
| Advanced 3D integration technologies in various quantum computing devices P Zhao, YD Lim, HY Li, G Luca, CS Tan IEEE Open Journal of Nanotechnology 2, 101-110, 2021 | 11 | 2021 |
| Field emission properties of SiO2-wrapped CNT field emitter YD Lim, L Hu, X Xia, Z Ali, S Wang, BK Tay, S Aditya, J Miao Nanotechnology 29 (1), 015202, 2017 | 11 | 2017 |
| Design and fabrication of grating couplers for the optical addressing of trapped ions YD Lim, HY Li, P Zhao, J Tao, L Guidoni, CS Tan IEEE Photonics Journal 13 (4), 1-6, 2021 | 10 | 2021 |
| Temperature-dependent selective growth of carbon nanotubes in Si/SiO2 structures for field emitter array applications YD Lim, L Hu, AV Avramchuck, D Grapov, BK Tay, S Aditya, J Miao, ... Materials research bulletin 95, 129-137, 2017 | 10 | 2017 |
| Time-dependent evolution study of Ar/N2 plasma-activated Cu surface for enabling two-step Cu-Cu direct bonding in a non-vacuum environment L Hu, SCK Goh, J Tao, YD Lim, P Zhao, MJZ Lim, T Salim, ... ECS Journal of Solid State Science and Technology 10 (12), 124001, 2021 | 8 | 2021 |
| Glass substrate interposer for TSV-integrated surface electrode ion trap P Zhao, HY Li, YD Lim, J Tao, WW Seit, L Guidoni, CS Tan 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 262-265, 2020 | 8 | 2020 |
| Chemical reaction dependency, magnetic field and surfactant effects on the propulsion of disk‐like micromotor and its application for E. coli transportation L Hu, N Wang, YD Lim, J Miao Nano Select 1 (4), 432-442, 2020 | 8 | 2020 |
| Two-Step Ar/N2 Plasma-Activated Al Surface for Al-Al Direct Bonding L Hu, YD Lim, P Zhao, MJZ Lim, CS Tan 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 324-329, 2022 | 7 | 2022 |
| Multi-die to wafer bonding through plasma-activated Cu-Cu direct bonding in ambient conditions L Hu, SCK Goh, YD Lim, P Zhao, MJZ Lim, CS Tan 2021 IEEE International 3D Systems Integration Conference (3DIC), 1-5, 2021 | 7 | 2021 |
| RF performance benchmarking of TSV integrated surface electrode ion trap for quantum computing P Zhao, HY Li, J Tao, JP Likforman, YD Lim, WW Seit, L Guidoni, CS Tan IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 7 | 2021 |
Chuan Seng TanProfessor, Nanyang Technological University, Singapore | IEEE Fellow | IMAPS FellowVerified email at ntu.edu.sg
