Extending HKMG scaling on CMOS with FDSOI: Advantages and integration challenges DH Triyoso, R Carter, J Kluth, K Hempel, M Gribelyuk, L Kang, A Kumar, ... IC Design and Technology (ICICDT), 2016 International Conference on, 1-4, 2016 | 15 | 2016 |
Comparisons between Membrane, Bridge and Cantilever Miniaturized Resistive Vacuum Gauges KG Punchihewa, E Zaker, R Kuljic, K Banerjee, T Dankovic, A Feinerman, ... Sensors 12 (7), 8770-8781, 2012 | 12 | 2012 |
Analog, RF, and ESD device challenges and solutions for 14nm FinFET technology and beyond J Singh, C Jerome, A Wei, R Miller, B Arnaud, C Lili, H Zang, P Kasun, ... 2014 Symposia on VLSI Technology and Circuits, 1-2, 0 | 12* | |
Extension of operating range towards lower pressures of MEMS-based thermal vacuum gauges by laser-induced heating T Dankovic, KAG Punchihewa, E Zaker, S Farid, P Habibimehr, ... Procedia Engineering 47, 1243-1246, 2012 | 9 | 2012 |
Factors impacting threshold voltage in Advanced CMOS integration: gate last (FINFET) vs. gate first (FDSOI) D Triyoso, R Carter, J Kluth, S Luning, A Child, J Wahl, B Mulfinger, ... ECS Transactions 69 (5), 103-110, 2015 | 5 | 2015 |
Factors Impacting Threshold Voltage in Advanced CMOS Integration: Gate Last (FINFET) vs. Gate First (FDSOI) D Triyoso, R Carter, J Kluth, S Luning, A Child, J Wahl, B Mulfinger, ... ECS Meeting Abstracts, 821, 2015 | 5 | 2015 |
Thermal-based MEMS vacuum gauges for measuring pressures from 10− 2 Torr to 10− 6 Torr E Zaker, S Farid, SK Selvaraj, C Bhavanarayana, D Sorto, R Kaur, ... Vacuum Nanoelectronics Conference (IVNC), 2012 25th International, 1-2, 2012 | 4 | 2012 |
Extending Advanced CMOS Scaling with SiGe Channel Materials RJ Carter, R Sporer, DH Triyoso, A Child, GR Mulfinger, JA Wahl, ... ECS Meeting Abstracts, 1368, 2018 | 3 | 2018 |
Extending Advanced CMOS Scaling with SiGe Channel Materials RJ Carter, R Sporer, DH Triyoso, A Child, GR Mulfinger, JA Wahl, ... Meeting Abstracts, 1368-1368, 2018 | 3 | 2018 |
SIMPLIFIED GATE TO SOURCE/DRAIN REGION CONNECTIONS TG Neogi, SD Luning, D Pritchard, KA Punchihewa US Patent App. 15/437,846, 2018 | 1 | 2018 |
Fin diode with increased junction area KA Punchihewa, J Singh US Patent 10,056,368, 2018 | 1 | 2018 |
Fin diode with increased junction area KA Punchihewa, J Singh US Patent 9,793,262, 2017 | 1 | 2017 |
Improvement of the sensitivity and operating range of MEMS-based resistive-type vacuum gauges KG Punchihewa, E Zaker, R Kuljic, A Rangaraj, M Liu, M Purahmad, ... Vacuum Nanoelectronics Conference (IVNC), 2011 24th International, 191-192, 2011 | 1 | 2011 |
Improvement of the sensitivity and operating range of MEMS-based resistive-type vacuum gauges KG Punchihewa, E Zaker, R Kuljic, A Rangaraj, M Liu, M Purahmad, ... Vacuum Nanoelectronics Conference (IVNC), 2011 24th International, 191-192, 2011 | 1 | 2011 |
Development of a Meso-scale Drift-free Pressure-sensor for Glaucoma Patients A Duffy, K Punchihewa, A Feinerman Journal of Undergraduate Research, 2009 | 1 | 2009 |
Contact punch through mitigation in SOI substrate KAG Punchihewa, D Wehella-Gamage US Patent 9,893,086, 2018 | | 2018 |
Nano Fabricated 3D Extracellular Matrix (ECM) Scaffolds to alter the Cancer Cell Behavior KAG PUNCHIHEWA University of Illinois at Chicago, 2012 | | 2012 |
3-D magnetic nanostructures J Sautner, K Punchihewa, B Ilic, P Vavassori, A Metlushko, V Metlushko Electromagnetics in Advanced Applications (ICEAA), 2011 International …, 2011 | | 2011 |
Nano Cheese K Gardiye Punchihewa | | 2011 |
Nano Cheese KG Punchihewa University of Illinois Chicago. Library., 2011 | | 2011 |