| The effect of undercooling on the microstructure and tensile properties of hypoeutectic Sn–6.5 Zn–xCu Pb-free solders AA El-Daly, WM Desoky, AF Saad, NA Mansor, EH Lotfy, ... Materials & Design 80, 152-162, 2015 | 47 | 2015 |
| Robust effects of Bi doping on microstructure development and mechanical properties of hypoeutectic Sn–6.5 Zn solder alloy AA El-Daly, HA Hashem, N Radwan, F El-Tantawy, TR Dalloul, ... Journal of Materials Science: Materials in Electronics 27, 2950-2962, 2016 | 17 | 2016 |
| Microstructural, thermal and mechanical properties of Co added Sn–0.7 Cu lead-free solder alloy AM El-Taher, HM Abd Elmoniem, S Mosaad Journal of Materials Science: Materials in Electronics 34 (7), 590, 2023 | 6 | 2023 |
| Analysis of the natural activities of radionuclides, heavy metals, and other poisonous elements in lead-free Sn–6.5 Zn solders with different alloying elements NA Mansour, AF Saad, AERA El-Daly, S Salama, H Hashem, ... Journal of Taibah University for Science 10 (2), 221-226, 2016 | 3 | 2016 |
