Khaled Salah
Khaled Salah
Mentor, A Siemens Business
Verified email at mentor.com - Homepage
Title
Cited by
Cited by
Year
Equivalent lumped element models for various n-port Through Silicon Vias networks
K Salah, H Ragai, Y Ismail, A El Rouby
16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011), 176-183, 2011
292011
Compact lumped element model for TSV in 3D-ICs
K Salah, A El Rouby, H Ragai, K Amin, Y Ismail
2011 IEEE International Symposium of Circuits and Systems (ISCAS), 2321-2324, 2011
252011
A UVM-based smart functional verification platform: Concepts, pros, cons, and opportunities
K Salah
2014 9th International Design and Test Symposium (IDT), 94-99, 2014
222014
Implementation and verification of a generic universal memory controller based on UVM
K Khalifa, K Salah
2015 10th International Conference on Design & Technology of Integrated …, 2015
162015
Arbitrary modeling of TSVs for 3D integrated circuits
K Salah, Y Ismail, A El-Rouby
Springer, 2014
112014
3D/TSV enabling technologies for SOC/NOC: Modeling and design challenges
K Salah, A El Rouby, H Ragai, Y Ismail
2010 International Conference on Microelectronics, 268-271, 2010
102010
IP Cores Design from Specifications to Production: Modeling, Verification, Optimization, and Protection.
KS Mohamed
Springer International Publishing, 2016. 13-50., 2016
92016
Internet of things: A comparative study
BE El-Shweky, K El-Kholy, M Abdelghany, M Salah, M Wael, O Alsherbini, ...
2018 IEEE 8th Annual Computing and Communication Workshop and Conference …, 2018
82018
Machine Learning for Model Order Reduction
KS Mohamed
Springer 2018, 2018
82018
A novel model order reduction technique based on artificial intelligence
K Salah
Microelectronics journal 65, 58-71, 2017
82017
Memory controller architectures: A comparative study
K Khalifa, H Fawzy, S El-Ashry, K Salah
2013 8th IEEE Design and Test Symposium, 1-6, 2013
82013
A closed form expression for TSV-based on-chip spiral inductor
K Salah, A El Rouby, H Ragai, Y Ismail
2012 IEEE International Symposium on Circuits and Systems, 2325-2328, 2012
82012
New TSV-Based applications: Resonant inductive coupling, variable inductor, power amplifier, bandpass filter, and antenna
K Salah, Y Ismail
2015 IEEE 13th International New Circuits and Systems Conference (NEWCAS), 1-4, 2015
62015
Compact TSV modeling for low power application
K Salah, A El-Rouby, Y Ismail, H Ragai, K Amin
2010 International Conference on Energy Aware Computing, 1-2, 2010
62010
A generic model order reduction technique based on Particle Swarm Optimization (PSO) algorithm
K Salah
IEEE EUROCON 2017-17th International Conference on Smart Technologies, 193-196, 2017
52017
Coverage closure efficient UVM based generic verification architecture for flash memory controllers
A El-Yamany, S El-Ashry, K Salah
2016 17th International Workshop on Microprocessor and SOC Test and …, 2016
52016
Model order reduction using artificial neural networks
A Adel, K Salah
2016 IEEE International Conference on Electronics, Circuits and Systems …, 2016
52016
TSV-based 3D integration fabrication technologies: An overview
K Salah
2014 9th International Design and Test Symposium (IDT), 253-256, 2014
52014
Analysis of coupling capacitance between TSVs and metal interconnects in 3D-ICs
K Salah
2012 19th IEEE International Conference on Electronics, Circuits, and …, 2012
52012
IoT Cloud Computing, Storage, and Data Analytics
KS Mohamed
The Era of Internet of Things, 71-91, 2019
42019
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