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Daniel Revier
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Additively manufactured nanotechnology and origami-enabled flexible microwave electronics
JG Hester, S Kim, J Bito, T Le, J Kimionis, D Revier, C Saintsing, W Su, ...
Proceedings of the IEEE 103 (4), 583-606, 2015
1082015
Inkjet-printed, vertically-integrated, high-performance inductors and transformers on flexible LCP substrate
BS Cook, C Mariotti, JR Cooper, D Revier, BK Tehrani, L Aluigi, L Roselli, ...
2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-4, 2014
662014
Lens cleaning via electrowetting
DL Revier, BS Cook, DP Magee, SJ Fedigan
US Patent 10,908,414, 2021
212021
Integrated circuit with dielectric waveguide connector using photonic bandgap structure
BS Cook, DL Revier
US Patent 10,371,891, 2019
182019
The principles of" smart" encapsulation: using additive printing technology for the realization of intelligent application-specific packages for IoT, 5G, and automotive radar …
B Tehrani, R Bahr, D Revier, B Cook, M Tentzeris
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 111-117, 2018
172018
Methods and apparatus for electrostatic control of expelled material for lens cleaners
BS Cook, DL Revier, SJ Fedigan, DP Magee
US Patent 11,607,704, 2023
132023
Methods and apparatus for surface wetting control
DL Revier, BS Cook, DP Magee, SJ Fedigan
US Patent 10,780,467, 2020
132020
Galvanic signal path isolation in an encapsulated package using a photonic structure
BS Cook, DL Revier
US Patent 10,444,432, 2019
92019
Expanding the design space for electrically-driven soft robots through handed shearing auxetics
I Good, T Brown-Moore, A Patil, D Revier, JI Lipton
2022 International Conference on Robotics and Automation (ICRA), 10951-10957, 2022
82022
Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure
BS Cook, DL Revier
US Patent 10,497,651, 2019
82019
Kinematic modeling of handed shearing auxetics via piecewise constant curvature
A Garg, I Good, D Revier, K Airis, J Lipton
2022 IEEE 5th International Conference on Soft Robotics (RoboSoft), 423-430, 2022
72022
Spectrometry in integrated circuit using a photonic bandgap structure
BS Cook, DL Revier
US Patent 10,557,754, 2020
72020
Applied viscous thread instability for manufacturing 3D printed foams
B Emery, D Revier
Proceedings of the 7th Annual ACM Symposium on Computational Fabrication, 1-2, 2022
62022
Thermal management in integrated circuit using phononic bandgap structure
BS Cook, DL Revier
US Patent 10,886,187, 2021
52021
Acoustic management in integrated circuit using phononic bandgap structure
DL Revier, BS Cook
US Patent 10,833,648, 2020
52020
Nanoparticle backside die adhesion layer
BS Cook, DL Revier, S Naseem, MH Chowdhury
US Patent 11,031,364, 2021
42021
3D printed semiconductor package
BS Cook, DL Revier
US Patent 10,910,465, 2021
32021
Semiconductor package with liquid metal conductors
DP Parekh, BS Cook, DL Revier, J Bito
US Patent 10,879,151, 2020
32020
A low-cost, single platform, hybrid manufacturing system for RF passives
DL Revier, MM Tentzeris
2017 IEEE Radio and Wireless Symposium (RWS), 83-85, 2017
32017
Beam former development for the NASA Hurricane Imaging Radiometer
GD Hopkins, JR Skala, DL Revier, MW James, DE Simmons, CS Ruf, ...
2015 IEEE Aerospace Conference, 1-15, 2015
32015
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