On size and magnetics: Why small efficient power inductors are rare CR Sullivan, BA Reese, ALF Stein, PA Kyaw 2016 International Symposium on 3D Power Electronics Integration and …, 2016 | 154 | 2016 |
A low-loss inductor structure and design guidelines for high-frequency applications RS Yang, AJ Hanson, BA Reese, CR Sullivan, DJ Perreault IEEE Transactions on Power Electronics 34 (10), 9993-10005, 2019 | 69 | 2019 |
High-temperature silicon-on-insulator gate driver for SiC-FET power modules J Valle-Mayorga, CP Gutshall, KM Phan, I Escorcia-Carranza, ... IEEE Transactions on Power Electronics 27 (11), 4417-4424, 2012 | 67 | 2012 |
High-temperature silicon-on-insulator gate driver for SiC-FET power modules J Valle-Mayorga, CP Gutshall, KM Phan, I Escorcia-Carranza, ... IEEE Transactions on Power Electronics 27 (11), 4417-4424, 2012 | 67 | 2012 |
High-temperature silicon carbide and silicon on insulator based integrated power modules A Lostetter, J Hornberger, B McPherson, B Reese, R Shaw, M Schupbach, ... 2009 IEEE Vehicle Power and Propulsion Conference, 1032-1035, 2009 | 60 | 2009 |
High temperature half bridge gate driver BA Reese, JA Valle-Mayorga, I Escorcia-Carranza, KM Phan, CP Gutshall, ... US Patent 8,643,407, 2014 | 44 | 2014 |
Litz wire in the MHz range: Modeling and improved designs BA Reese, CR Sullivan 2017 IEEE 18th Workshop on Control and Modeling for Power Electronics …, 2017 | 31 | 2017 |
Microfabricated racetrack inductors with thin-film magnetic cores for on-chip power conversion DV Harburg, AJ Hanson, J Qiu, BA Reese, JD Ranson, DM Otten, ... IEEE Journal of Emerging and Selected Topics in Power Electronics 6 (3 …, 2018 | 29 | 2018 |
Packaging of high temperature 50 kW SiC motor drive modules for hybrid-electric vehicles B McPherson, J Hornberger, J Bourne, A Lostetter, R Schupbach, R Shaw, ... IMAPS 2009, 663-670, 2009 | 27 | 2009 |
High voltage, high power density bi-directional multi-level converters utilizing silicon and silicon carbide (SiC) switches B Reese, M Schupbach, A Lostetter, B Rowden, R Saunders, J Balda 2008 Twenty-Third Annual IEEE Applied Power Electronics Conference and …, 2008 | 27 | 2008 |
Low-loss noise-resistant high-temperature gate driver circuits J Hornberger, B Reese, E Cilio, RM Schupbach, A Lostetter, S Mounce US Patent 7,965,522, 2011 | 18 | 2011 |
Superior mechanical and magnetic performance of highly anisotropic sendust‐flake composites freeze cast in a uniform magnetic field K Yin, BA Reese, CR Sullivan, UGK Wegst Advanced Functional Materials 31 (8), 2007743, 2021 | 17 | 2021 |
Design aspects of multi-phase interleaved resonant switched-capacitor converters with mm-scale air-core inductors C Schaef, B Reese, CR Sullivan, JT Stauth 2015 IEEE 16th workshop on control and modeling for power electronics …, 2015 | 17 | 2015 |
Improved litz-wire designs for the MHz range BA Reese, R Joseph, CR Sullivan 2018 IEEE 19th Workshop on Control and Modeling for Power Electronics …, 2018 | 15 | 2018 |
High temperature (250 C) silicon carbide power modules with integrated gate drive boards B Reese, B McPherson, R Shaw, J Hornberger, R Schupbach, A Lostetter, ... Additional Papers and Presentations 2010 (HITEC), 000297-000304, 2010 | 15 | 2010 |
Wide bandgap packaging for next generation power conversion systems B Passmore, Z Cole, B McPherson, B Whitaker, D Martin, A Barkley, ... 2013 4th IEEE International Symposium on Power Electronics for Distributed …, 2013 | 10 | 2013 |
The effect of permeability on magnetic core performance factors BA Reese, CR Sullivan 2017 IEEE 18th Workshop on Control and Modeling for Power Electronics …, 2017 | 7 | 2017 |
High temperature equalized electrical parasitic power packaging method for many paralleled semiconductor power devices J Bourne, J Hornberger, A Lostetter, B Mcpherson, T McNutt, B Reese, ... US Patent 9,095,054, 2015 | 6 | 2015 |
High temperature silicon carbide power modules for high performance systems AB Lostetter, J Hornberger, B McPherson, J Bourne, R Shaw, E Cilio, ... Materials Science Forum 717, 1219-1224, 2012 | 6 | 2012 |
High temperature silicon carbide power modules for high performance systems J Hornberger, B McPherson, J Bourne, R Shaw, E Cilio, W Cilio, B Reese, ... Additional Papers and Presentations 2011 (HITEN), 000159-000166, 2011 | 6 | 2011 |