| Power Noise and Near Field EMI of High Current System-in-Package with VR Top and Bottom Placement K Xu, B Vaisband, G Sizikov, X Li, EG Friedman IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (4 …, 2019 | 15 | 2019 |
| Scaling trends of power noise in 3-D ICs K Xu, EG Friedman INTEGRATION, the VLSI journal 51, 139-148, 2015 | 15 | 2015 |
| Power delivery exploration methodology based on constrained optimization R Bairamkulov, K Xu, M Popovich, JS Ochoa, V Srinivas, EG Friedman IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2019 | 13 | 2019 |
| Exploratory design of on-chip power delivery for 14, 10, and 7 nm and beyond FinFET ICs K Xu, R Patel, P Raghavan, EG Friedman Integration 61, 11-19, 2018 | 13 | 2018 |
| EMI Suppression With Distributed $ LLC $ Resonant Converter for High-Voltage VR-on-Package K Xu, B Vaisband, G Sizikov, X Li, EG Friedman IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 5 | 2019 |
| Versatile framework for power delivery exploration R Bairamkulov, K Xu, EG Friedman, M Popovich, J Ochoa, V Srinivas 2018 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2018 | 5 | 2018 |
| Distributed Sinusoidal Resonant Converter with High Step-Down Ratio K Xu, B Vaisband, G Sizikov, X Li, EG Friedman Electrical Performance of Electronics Packaging and Systems (EPEPS), 2017 …, 2017 | 4 | 2017 |
| Challenges in high current on-chip voltage stacked systems K Xu, EG Friedman 2020 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2020 | 3 | 2020 |
| Distributed port assignment for extraction of power delivery networks K Xu, EG Friedman, M Popovich, G Sizikov 2020 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2020 | 2 | 2020 |
| Grid-Based Redistribution Layers Within 3-D Power Networks K Xu, EG Friedman IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 1 | 2021 |
| Converter Topologies for On-Package Voltage Stacking N Zhuldassov, K Xu, EG Friedman 2022 IEEE International Symposium on Circuits and Systems (ISCAS), 546-550, 2022 | | 2022 |
| Tile-Based Power Delivery Networks for High Current, Voltage Stacked Systems K Xu, N Zhuldassov, EG Friedman IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | | 2021 |
| Power Delivery in High Current 3-D Systems K Xu University of Rochester, 2020 | | 2020 |
| Exploratory power noise models of standard cell 14, 10, and 7 nm FinFET ICs R Patel, K Xu, EG Friedman, P Raghavan Proceedings of the 26th edition on Great Lakes Symposium on VLSI, 233-238, 2016 | | 2016 |
| Inductive coupling effects in large TSV arrays K Xu, EG Friedman 2015 IEEE International Symposium on Circuits and Systems (ISCAS), 2888-2891, 2015 | | 2015 |
