| Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits AS Budiman, HAS Shin, BJ Kim, SH Hwang, HY Son, MS Suh, QH Chung, ... Microelectronics Reliability 52 (3), 530-533, 2012 | 147 | 2012 |
| The development of microstructure and the influence of processing route during equal channel angular drawing of pure aluminum U Chakkingal, AB Suriadi, PF Thomson Materials Science and Engineering: A 266 (1-2), 241-249, 1999 | 143 | 1999 |
| Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction AS Budiman, WD Nix, N Tamura, BC Valek, K Gadre, J Maiz, R Spolenak, ... Applied Physics Letters 88 (23), 2006 | 132 | 2006 |
| A search for evidence of strain gradient hardening in Au submicron pillars under uniaxial compression using synchrotron X-ray microdiffraction AS Budiman, SM Han, JR Greer, N Tamura, JR Patel, WD Nix Acta Materialia 56 (3), 602-608, 2008 | 112 | 2008 |
| Microstructure development during equal channel angular drawing of Al at room temperature U Chakkingal, AB Suriadi, PF Thomson Scripta Materialia 39 (6), 677-684, 1998 | 98 | 1998 |
| Microstructure evolution and defect formation in Cu through-silicon vias (TSVs) during thermal annealing HAS Shin, BJ Kim, JH Kim, SH Hwang, AS Budiman, HY Son, KY Byun, ... Journal of Electronic Materials 41, 712-719, 2012 | 80 | 2012 |
| Microcompression study of Al-Nb nanoscale multilayers Y Kim, AS Budiman, JK Baldwin, NA Mara, A Misra, SM Han Journal of Materials Research 27 (3), 592-598, 2012 | 70 | 2012 |
| Indentation size effects in single crystal copper as revealed by synchrotron x-ray microdiffraction G Feng, AS Budiman, WD Nix, N Tamura, JR Patel Journal of Applied Physics 104 (4), 2008 | 70 | 2008 |
| Fabrication, microstructure, and mechanical properties of tin nanostructures MJ Burek, AS Budiman, Z Jahed, N Tamura, M Kunz, S Jin, SMJ Han, ... Materials Science and Engineering: A 528 (18), 5822-5832, 2011 | 67 | 2011 |
| Enabling thin silicon technologies for next generation c-Si solar PV renewable energy systems using synchrotron X-ray microdiffraction as stress and crack mechanism probe AS Budiman, G Illya, V Handara, WA Caldwell, C Bonelli, M Kunz, ... Solar Energy Materials and Solar Cells 130, 303-308, 2014 | 66 | 2014 |
| Plasticity evolution in nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron X-ray microdiffraction AS Budiman, KR Narayanan, N Li, J Wang, N Tamura, M Kunz, A Misra Materials Science and Engineering: A 635, 6-12, 2015 | 61 | 2015 |
| From cells to laminate: Probing and modeling residual stress evolution in thin silicon photovoltaic modules using synchrotron X‐ray micro‐diffraction experiments and finite … SK Tippabhotla, I Radchenko, WJR Song, G Illya, V Handara, M Kunz, ... Progress in Photovoltaics: research and applications 25 (9), 791-809, 2017 | 60 | 2017 |
| Plasticity in the nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron Laue x-ray microdiffraction AS Budiman, SM Han, N Li, QM Wei, P Dickerson, N Tamura, M Kunz, ... Journal of Materials Research 27 (3), 599-611, 2012 | 57 | 2012 |
| Effects of interface shear strength during failure of semicoherent metal–metal nanolaminates: An example of accumulative roll-bonded Cu/Nb I Radchenko, HP Anwarali, SK Tippabhotla, AS Budiman Acta Materialia 156, 125-135, 2018 | 54 | 2018 |
| Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment AS Budiman, CS Hau-Riege, WC Baek, C Lor, A Huang, HS Kim, ... Journal of electronic materials 39, 2483-2488, 2010 | 52 | 2010 |
| Growth and structural characterization of epitaxial Cu/Nb multilayers AS Budiman, N Li, Q Wei, JK Baldwin, J Xiong, H Luo, D Trugman, QX Jia, ... Thin Solid Films 519 (13), 4137-4143, 2011 | 49 | 2011 |
| Probing phase transformations and microstructural evolutions at the small scales: Synchrotron X-ray microdiffraction for advanced applications in 3D IC (integrated circuits … I Radchenko, SK Tippabhotla, N Tamura, AS Budiman Journal of Electronic Materials 45, 6222-6232, 2016 | 47 | 2016 |
| Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films CY Khoo, H Liu, WA Sasangka, RI Made, N Tamura, M Kunz, AS Budiman, ... Journal of materials science 51, 1864-1872, 2016 | 46 | 2016 |
| Numerical simulation of the evolution of stress in solar cells during the entire manufacturing cycle of a conventional silicon wafer based photovoltaic laminate WJR Song, SK Tippabhotla, AAO Tay, AS Budiman IEEE journal of photovoltaics 8 (1), 210-217, 2017 | 45 | 2017 |
| Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction VA Handara, I Radchenko, SK Tippabhotla, KR Narayanan, G Illya, ... Solar Energy Materials and Solar Cells 162, 30-40, 2017 | 45 | 2017 |
Nan LiLos Alamos National Laboratoryبريد إلكتروني تم التحقق منه على lanl.gov
