Get my own profile
Public access
View all15 articles
1 article
available
not available
Based on funding mandates
Co-authors
- Tania RoyDuke UniversityVerified email at duke.edu
- Adithi KrishnaprasadBackend Integration Engineer, Intel CorporationVerified email at intel.com
- Yeonwoong (Eric) JungProfessor, Materials Science & Engineering, University of Central FloridaVerified email at ucf.edu
- Hee-Suk ChungPrincipal Researcher, Korea Basic Science Institute, Republic of KoreaVerified email at kbsi.re.kr
- Mashiyat Sumaiya ShawkatPhD Candidate, Electrical EngineeringVerified email at knights.ucf.edu
- Laurene TetardUniversity of Central FloridaVerified email at ucf.edu
- Sang Sub HanUniversity of Central Florida, USVerified email at ucf.edu
- Hirokjyoti KalitaMicron TechnologyVerified email at micron.com
- Molla Manjurul IslamSenior Engineer I-Device, Microchip Technology Inc.Verified email at microchip.com
- Tae-Jun KoNanobiofabVerified email at nanobiofab.com
- Elizabeth A. Barrios, PhD.NASAVerified email at knights.ucf.edu
- Dr. Deepak PandeyUniversity of Central Florida, NanoScience Technology centerVerified email at ucf.edu
- YounJoon JungDepartment of Chemistry, Seoul National UniversityVerified email at snu.ac.kr
- Lei ZhaiUniversity of Central FloridaVerified email at ucf.edu
- Estiak AhmadIntel CorporationVerified email at intel.com
- Shanthi Iyer alias E.ShanthiProfessor, Nanoengineering, Joint School of Nanoscience and NanoengineeringVerified email at ncat.edu
- Manish Sharma, Ph.D.Intel CorporationVerified email at intel.com
- Daniel M. FleetwoodProfessor of Electrical Engineering, Vanderbilt UniversityVerified email at vanderbilt.edu
- Akio YamamotoUniversity of FukuiVerified email at u-fukui.ac.jp
Follow