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Bijan Tehrani
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Multilayer inkjet printing of millimeter-wave proximity-fed patch arrays on flexible substrates
BS Cook, B Tehrani, JR Cooper, MM Tentzeris
IEEE Antennas and wireless propagation letters 12, 1351-1354, 2013
1192013
Inkjet printing of multilayer millimeter-wave Yagi-Uda antennas on flexible substrates
BK Tehrani, BS Cook, MM Tentzeris
IEEE Antennas and Wireless Propagation Letters 15, 143-146, 2015
1162015
Additively manufactured nanotechnology and origami-enabled flexible microwave electronics
JG Hester, S Kim, J Bito, T Le, J Kimionis, D Revier, C Saintsing, W Su, ...
Proceedings of the IEEE 103 (4), 583-606, 2015
1062015
Inkjet-printed 3D interconnects for millimeter-wave system-on-package solutions
BK Tehrani, BS Cook, MM Tentzeris
2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016
812016
Additively manufactured RF components and modules: Toward empowering the birth of cost-efficient dense and ubiquitous IoT implementations
SA Nauroze, JG Hester, BK Tehrani, W Su, J Bito, R Bahr, J Kimionis, ...
Proceedings of the IEEE 105 (4), 702-722, 2017
662017
Inkjet-printed, vertically-integrated, high-performance inductors and transformers on flexible LCP substrate
BS Cook, C Mariotti, JR Cooper, D Revier, BK Tehrani, L Aluigi, L Roselli, ...
2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-4, 2014
642014
Exploring 3-D printing for new applications: Novel inkjet-and 3-D-printed millimeter-wave components, interconnects, and systems
R Bahr, B Tehrani, MM Tentzeris
IEEE Microwave magazine 19 (1), 57-66, 2017
462017
Additively manufactured mm-wave multichip modules with fully printed “smart” encapsulation structures
X He, BK Tehrani, R Bahr, W Su, MM Tentzeris
IEEE Transactions on Microwave Theory and Techniques 68 (7), 2716-2724, 2019
452019
E-band characterization of 3D-printed dielectrics for fully-printed millimeter-wave wireless system packaging
BK Tehrani, RA Bahr, W Su, BS Cook, MM Tentzeris
2017 IEEE MTT-S International Microwave Symposium (IMS), 1756-1759, 2017
452017
First demonstration of 28 GHz and 39 GHz transmission lines and antennas on glass substrates for 5G modules
AO Watanabe, M Ali, B Tehrani, J Hester, H Matsuura, T Ogawa, PM Raj, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 236-241, 2017
402017
Development, characterization, and processing of thin and thick inkjet-printed dielectric films
BK Tehrani, C Mariotti, BS Cook, L Roselli, MM Tentzeris
Organic Electronics 29, 135-141, 2016
382016
Inkjet-/3D-/4D-printed perpetual electronics and modules: RF and mm-wave devices for 5G+, IoT, smart agriculture, and smart cities applications
A Eid, X He, R Bahr, TH Lin, Y Cui, A Adeyeye, B Tehrani, MM Tentzeris
IEEE Microwave Magazine 21 (12), 87-103, 2020
342020
Fully inkjet-printed multilayer microstrip and T-resonator structures for the RF characterization of printable materials and interconnects
BK Tehrani, J Bito, BS Cook, MM Tentzeris
2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-4, 2014
322014
Fully inkjet-printed ramp interconnects for wireless Ka-band MMIC devices and multi-chip module packaging
BK Tehrani, MM Tentzeris
2018 48th European Microwave Conference (EuMC), 1037-1040, 2018
292018
Novel uniquely 3D printed intricate Voronoi and fractal 3D antennas
RA Bahr, Y Fang, W Su, B Tehrani, V Palazzi, MM Tentzeris
2017 IEEE MTT-S International Microwave Symposium (IMS), 1583-1586, 2017
232017
Nanotechnology-empowered flexible printed wireless electronics: A review of various applications of printed materials
A Eid, J Hester, Y Fang, B Tehrani, SA Nauroze, R Bahr, MM Tentzeris
IEEE Nanotechnology Magazine 13 (1), 18-29, 2018
212018
Fully inkjet-printed multilayer microstrip patch antenna for Ku-band applications
J Bito, B Tehrani, B Cook, M Tentzeris
2014 IEEE Antennas and Propagation Society International Symposium (APSURSI …, 2014
202014
Ultralow-loss substrate-integrated waveguides in glass-based substrates for millimeter-wave applications
AO Watanabe, BK Tehrani, T Ogawa, PM Raj, MM Tentzeris, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
192020
Post-process fabrication of multilayer mm-wave on-package antennas with inkjet printing
BK Tehrani, BS Cook, MM Tentzeris
2015 IEEE International Symposium on Antennas and Propagation & USNC/URSI …, 2015
172015
The principles of" smart" encapsulation: using additive printing technology for the realization of intelligent application-specific packages for IoT, 5G, and automotive radar …
B Tehrani, R Bahr, D Revier, B Cook, M Tentzeris
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 111-117, 2018
162018
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