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Co-authors

Yehea IsmailProfessor, the American University in Cairo, zewail cityVerified email at aucegypt.edu
Eslam Yahya TawfikResearch ProfessorVerified email at osu.edu
Mohamed DessoukyProfessor of Electronics, Faculty of Engineering, Ain Shams UniversityVerified email at eng.asu.edu.eg

Tarek Ramadan

Tarek Ramadan

Faculty of Engineering, Ain Shams University - Mentor Graphics

Verified email at mentor.com

Three Dimensional Integrated Circuits (3D-ICs)Through Silicon Via (TSVs)Interconnects Modeling Parasitic Extraction Integr


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Coupling capacitance in through‐silicon vias: non‐homogeneous medium effect T Ramadan, E Yahya, Y Ismail, M Dessouky Electronics Letters 52 (2), 152-154, 2016	3	2016
Accuracy-improved coupling capacitance model for through-silicon via (TSV) arrays using dimensional analysis T Ramadan, E Yahya, M Dessouky, Y Ismail 2016 IEEE International Symposium on Circuits and Systems (ISCAS), 1930-1933, 2016	2	2016
Coupling capacitance extraction in through-silicon via (TSV) arrays T Ramadan, E Yahya, M Dessouky, Y Ismail 2015 IEEE International Conference on Electronics, Circuits, and Systems …, 2015	2	2015

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Articles 1–3