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Shengxuan Xia
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Inaudible attack on smart speakers with intentional electromagnetic interference
Z Xu, R Hua, J Juang, S Xia, J Fan, C Hwang
IEEE Transactions on Microwave Theory and Techniques 69 (5), 2642-2650, 2021
262021
Self-contact introduced passive intermodulation characterizations for captured springs
J Li, S Xia, Z Xu, Y Xu, Y Wang, Y He, K Wu, N McDonnell, W Lee, H Zhou, ...
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 929-934, 2021
62021
A SPICE-compatible model to simulate RFI-Induced buzz noise problem in a camera
W Zhang, S Xia, X Fang, X Wang, T Enomoto, H Shumiya, K Araki, ...
IEEE Transactions on Electromagnetic Compatibility 64 (4), 987-998, 2022
42022
Gassian Process Regression Analysis of Passive Intermodulation Level and DCR for Spring Contacts
S Xia, J Li, Y Xu, Z Sun, Z Xu, Y Wang, Y He, N McDonnell, H Zhou, K Wu, ...
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 935-939, 2021
42021
Practical fixture design for passive intermodulation tests for flexible metallic contacts
S Xia, Y He, Y Wang, H Wang, G Mankaruse, D Chan, H Zhou, W Lee, ...
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022
32022
Modeling and Statistical Characterization of Electromagnetic Coupling to Electronic Devices
J Hunter, S Xia, A Harmon, A Hassan, V Khilkevich, D Beetner
2021 United States National Committee of URSI National Radio Science Meeting …, 2021
32021
RFI estimation for multiple noise sources due to modulation at a digital mic using diople moment based reciprocity
S Xia, J Sun, Q Huang, Y Wang, H Wang, K Wu, S Wu, J Fan
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
32020
A Fast Cascading Method for Predicting the Coupling from External Plane Waves to PCBs
S Xia, J Hunter, A Harmon, MZM Hamdalla, AM Hassan, C Hwang, ...
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022
22022
A Segmentation Strategy for Structures with Common Mode Coupling
J Hunter, S Xia, A Harmon, MZM Hamdalla, AM Hassan, V Khilkevich, ...
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022
22022
A Thermal-aware DC-IR Drop Analysis for 2.5 D IC
S Xia, BM Dogruoz, Y Wang, S Wu, S Bai, C Hwang, Z Wu
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023
12023
Dielectric Loss Tangent Extraction Using Two Single-ended Striplines of Different Width
J Li, Y Liu, L Liu, S Xia, S Hinaga, V Khilkevich
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022
12022
Passive Intermodulation Under Different Spring Contact Conditions
S Xia, E Olugbade, Y He, Y Wang, H Wang, K Rao, M Poort, H Zhou, ...
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022
12022
A Segmentation Approach for Predicting Plane Wave Coupling to PCB Structures
S Xia, J Hunter, A Harmon, AM Hassan, V Khilkevich, DG Beetner
IEEE Transactions on Electromagnetic Compatibility, 2024
2024
Coupling Path Analysis for Smart Speaker Intentional Electromagnetic Interference Attacks
T Fokkens, S Xia, A Harmon, C Hwang
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023
2023
Static IV based PIM Evaluation for Spring and Fabric-over-Foam Contacts
KW Anjajo, Y Xu, S Xia, Y He, H Zhou, H Wang, J Park, C Hwang
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023
2023
Dipole-Moment-Based Reciprocity for Practical Desensitization Identification and Mitigation
S Xia, H Wang, Y Wang, Z Wu, C Hwang, J Fan
IEEE Transactions on Electromagnetic Compatibility, 2023
2023
Clock Duty Cycle Tuning for Desense Mitigation in Modulation-involved Cases
S Xia, J Fan, C Hwang
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022
2022
2023 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & SIGNAL/POWER INTEGRITY
M Ru, B Wendem, S Stephen, M Antyufe, C Schuste, B Arch, H Matthias, ...
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